Proprietary Process Technology
AnalogicTech combines advanced power management circuit design with proprietary process technology. We are the first company to develop mid/deep sub-micron CMOS technology specifically for building analog and mixed-signal power management ICs and discrete devices in very advanced, yet cost-depreciated DRAM fabs. Our dedicated process integration team works inside our partners' wafer fabs, installing proprietary process technology and customizing it for each facility. This enables AnalogicTech to produce attractively-priced products with many competitive advantages, including higher efficiency, faster response time, lower power consumption, less resistance for lower heat generation, and denser designs with tighter integration in space-saving packages.

TrenchDMOS
AnalogicTech's proprietary TrenchDMOS process technology offers revolutionary density and power advantages. Delivering up to 9x more density than commonly used trench-gate MOSFET processes, our Power MOSFET product line delivers unprecedented size and performance advantages. The TrenchDMOS process achieves these advantages by delivering significantly higher channel density (and therefore lower on-resistance) than conventional Trench MOSFETs. AnalogicTech's TrenchDMOS process currently offers a density of 287 million cells per square inch, while conventional production Trench FETs only reach approximately 100 million cells per square inch. Our highly innovative process will scale up to much higher density levels in the near future. Prototypes are currently under development for a process that will reach densities of 650 million cells per square inch.

Package Advancements
Working with packaging partners, AnalogicTech develops new packages that optimize device performance, save space, and offer ease-of-use and low cost. As package size continues to shrink, AnalogicTech offers significant new developments. For instance, our SC70JW package measures only 2.1mm long (lead-to-lead) by 2mm wide (4.2mm2 footprint). The SC70JW encapsulates a great deal of functionality in the smallest possible package while using standard surface mount technology. The SC70JW offers a die-to-footprint ratio that is five times greater than the standard SC70 with excellent thermal resistance.